| LED芯片封装缺陷检测方法研究 |
| |
| 引用本文： | 马小宁,高新涛.LED芯片封装缺陷检测方法研究[J].企业技术开发,2011(15):39+45. |
| |
| 作者姓名： | 马小宁 高新涛 |
| |
| 作者单位： | 郑州自动化研究所; |
| |
| 摘 要： | LED封装工艺是影响LED功能的重要因素,基于封装工艺自身的原因,LED封装过程中存在着诸多缺陷。检测LED的支架回路光电流和通过非接触法的方法检测待测的LED光激励信号,也能够轻松实现引脚式封装LED芯片在压焊工序中和亚焊工序后的功能状态及封装缺陷的检测。
|
| 关 键 词： | LED 特点优势 芯片封装 检测方法 |
Research of LED chip packaging detection method |
| |
| MA Xiao-ning,GAO Xin-tao.Research of LED chip packaging detection method[J].Technological Development of Enterprise,2011(15):39+45. |
| |
| Authors: | MA Xiao-ning GAO Xin-tao |
| |
| Institution: | MA Xiao-ning,GAO Xin-tao (Zhengzhou Automation Research Institute,Zhengzhou,Henan 450003,China) |
| |
| Abstract: | LED packaging technology is an important factor affecting the LED functions,based on its own reasons of packaging technology,there are many defects in LED packaging process.Detection LED circuit photocurrent of the stent and through non-contact method to detect the LED light test stimulus signal can easily pin-type LED package chip bonding processes and sub-state welding processes,the functions and packaging defects detection. |
| |
| Keywords: | LED characteristics and advantages chip packaging detection method |
| 本文献已被 CNKI 等数据库收录！ |
|
