| 基于电热模拟法的芯片热管散热器传热研究与仿真 |
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| 引用本文： | 袁 斌,潘家栋,蒋 炜,张淑娟.基于电热模拟法的芯片热管散热器传热研究与仿真[J].河北工业科技,2007,24(2):150-153. |
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| 作者姓名： | 袁 斌 潘家栋 蒋 炜 张淑娟 |
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| 作者单位： | 常熟华光玻璃太阳能技术有限公司,江苏常熟 215551;常熟华光玻璃太阳能技术有限公司,江苏常熟 215551;常熟华光玻璃太阳能技术有限公司,江苏常熟 215551;常熟华光玻璃太阳能技术有限公司,江苏常熟 215551 |
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| 摘 要： | 运用电热模拟法对一种热管式芯片散热器的各项传热热阻进行分析,建立了该热管散热器在强制风冷条件下的电网络传热模型,导出了总传热能力的理论计算公式；运用CFD软件ICEPAK对某一设计计算实例进行仿真,模拟结果与理论值基本吻合,验证了所建电网络模型的基本合理性。
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| 关 键 词： | 芯片散热器 热管 计算流体力学 ICEPAK 仿真 |
| 收稿时间： | 2006/9/5 0:00:00 |
| 修稿时间： | 2007/1/24 0:00:00 |
Research and simulation of heat transfer for heat pipe chip radiator based on electro-thermal simulation method |
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| YUAN Bin,PAN Jia-dong,JIANG Wei and ZHANG Shu-juan.Research and simulation of heat transfer for heat pipe chip radiator based on electro-thermal simulation method[J].Hebei Journal of Industrial Science & Technology,2007,24(2):150-153. |
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| Authors: | YUAN Bin PAN Jia-dong JIANG Wei and ZHANG Shu-juan |
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| Institution: | Changshu Chinasunpower Glass Suntech Company Limited,Changshu Jiangsu 215551,China;Changshu Chinasunpower Glass Suntech Company Limited,Changshu Jiangsu 215551,China;Changshu Chinasunpower Glass Suntech Company Limited,Changshu Jiangsu 215551,China;Changshu Chinasunpower Glass Suntech Company Limited,Changshu Jiangsu 215551,China |
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| Abstract: | The analysis on all thermal resistances in a sort of chip radiator with heat pipe is made through the method of electro-thermal simulation.The electric heat transfer model is established of the heat pipe chip radiator under forced air cooled condition, and the formula of its total heat-transfer ability is worked out. Then, a certain kind of designed instance is simulated by ICEPAK software,and the simulated result corresponds to the theoretical computational result basically,and so the validity of the electric heat transfer model is verified. |
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