| 光纤布拉格光栅(FBG)温度传感器增敏封装技术 |
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| 引用本文： | 于国庆,韩兴德,李永伟. 光纤布拉格光栅(FBG)温度传感器增敏封装技术[J]. 河北工业科技, 2009, 26(1): 1-4 |
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| 作者姓名： | 于国庆 韩兴德 李永伟 |
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| 作者单位： | 河北科技大学信息科学与工程学院,河北石家庄,050018;河北科技大学电气信息学院,河北石家庄,050018 |
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| 摘 要： | 介绍了光纤布拉格光栅(FBG)传感器测温的基本原理和封装方法,提出了一种新型的FBG温度传感器的封装技术,包括封装结构的设计及封装材料的合理选择,目的是提高FBG的温度敏感系数和消除应力的交叉影响。通过实验对裸光纤和封装后的光纤的温度特性、应力影响等进行了对比,结果表明:采用此法封装后的FBG对温度具有很好的线性度和重复性,基本上消除了应力的影响,可以准确监测温度,测温范围为-15~200℃,精度达到±0.05℃。
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| 关 键 词： | 光纤布拉格光栅(FBG) 封装方法 增敏技术 实验研究 |
| 收稿时间： | 2008-09-28 |
| 修稿时间： | 2008-12-18 |
Packaging technique of enhancing temperature-sensitivity for fiber bragg grating sensor |
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| YU Guo-qing,HAN Xing-de and LI Yong-wei. Packaging technique of enhancing temperature-sensitivity for fiber bragg grating sensor[J]. Hebei Journal of Industrial Science & Technology, 2009, 26(1): 1-4 |
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| Authors: | YU Guo-qing HAN Xing-de LI Yong-wei |
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| Affiliation: | 1.College of Information Science and Engineering;Hebei University of Science and Technology;Shijiazhuang Hebei 050018;China;2.College of Electrical Engineering and Information Science;China |
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| Abstract: | The basic principle and packaging methods of fiber bragg grating(FBG)temperature sensor are introduced.A new packaging technique of FBG temperature sensor,which includes the design of the packaging structure and the optimal choice for packaging material,is advanced.The purpose is to enhance the temperature sensitivity coefficient of FBG and to eliminate cross-impact of stress.Through experiments,the temperature characteristics and stress impact of the naked and packaged FBG are contrasted.The results show t... |
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| Keywords: | fiber bragg grating(FBG) packaging method enhancing temperature-sensitivity technique experimental research |
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