SOP集成技术的发展现状及其在毫米波系统中的应用

介绍了SOP（System On Package）集成技术，并与传统系统集成方法以及SOC（System O n Chip）、MIP（Module In Package）、MCM（Multi Chip Module）、SIP（System I n Package） 等微封装、微集成技术进行了比较和分析，揭示了SOP小型化、低成本、高可靠性、高性能 特点。对SOP在毫米波系统应用、新材料和新工艺的进展进行了总结，结果表明SOP在毫米波 系统中具有良好的应用前景。

Progress of SOP integration technology and its application in millimeter-wave systems

In this paper, System On Package(SOP) is introduced. SOP is compared with trad it ional system integration technology and other type s of integration technology, such as System On Chip(SOC),Module In Package(M IP), Multi Chip Module(MCM) and System In Package(SIP).On this base,it is il lustrated that SOP is featured by miniaturization,l ow cost,high reliability and high performance. And the progress of SOP in millimeter wave system application,new material and n ew manufacture technology is analyzed. The results show that SOP has pr omising future in millimeter wave systems.