| 微波功能模块温度阶梯焊工艺技术 |
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| 引用本文： | 李晓艳,赖复尧,王国华. 微波功能模块温度阶梯焊工艺技术[J]. 国际商务研究, 2008, 48(1): 113-116 |
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| 作者姓名： | 李晓艳 赖复尧 王国华 |
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| 作者单位： | 中国西南电子技术研究所 成都610036 |
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| 摘 要： | 针对微波功能模块的结构和电路功能特点,采用多种具有一定熔点间隔的焊料,对微波功能模块的基板、I/O接头、壳体等进行软钎焊连接,替代螺接、铆接等连接形式,为产品的小型化、耐环境、高可靠提供实用的工艺手段。
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| 关 键 词： | 微波集成电路 温度阶梯焊 焊透率 大面积焊接 |
| 收稿时间： | 2007-07-25 |
| 修稿时间： | 2007-11-17 |
Temperature Stepped Welding Technique for Microwave Function Modules |
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| LI Xiao-yan,LAI Fu-yao,WANG Guo-hua. Temperature Stepped Welding Technique for Microwave Function Modules[J]. International Business Research, 2008, 48(1): 113-116 |
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| Authors: | LI Xiao-yan LAI Fu-yao WANG Guo-hua |
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| Abstract: | In consideration of the structure and circuit functional character of microwave function modules,the circuit boards,I/O joints and shells of microwave function modules are connected by adopting the multi-melting point solders which can replace the connection form of bolting and riveting.This technique provides a practical method for the miniaturization,resistance to environment and high reliability of product. |
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| Keywords: | microwave integration circuit(MIC) temperature stepped welding complete welding speed large-area welding |
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