| 电气互联技术的现状及发展趋势 |
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| 引用本文： | 陈正浩.电气互联技术的现状及发展趋势[J].国际商务研究,2007,47(6):12-18. |
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| 作者姓名： | 陈正浩 |
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| 作者单位： | 中国西南电子技术研究所,成都610036 |
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| 摘 要： | 简要介绍了国外电气互联技术的现状，从电路可制造性设计、堆叠装配、FPC组装设计与工艺、PCB可制造性分析及虚拟设计技术、微波电路互联结构及绿色清洗技术等7个方面分析了电气互联先进制造技术的发展方向。
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| 关 键 词： | 电气互联技术 可制造性设计 堆叠装配 虚拟设计 互联结构 绿色清洗 |
| 修稿时间： | 2007/9/20 0:00:00 |
The Current Status and Developing Trend of Electrical Interconnection Technology |
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| CHEN Zheng-hao.The Current Status and Developing Trend of Electrical Interconnection Technology[J].International Business Research,2007,47(6):12-18. |
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| Authors: | CHEN Zheng-hao |
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| Abstract: | The current status of electrical interconnection technology in foreign countries is introduced,and the developing trend of electrical interconnection advanced manufacture technique is analyzed from seven aspects,including circuit design for manufacture(DFM),package in package(PiP),FPC assembly design and processing technology,PCB manufacturability analysis and virtual design technique,microwave circuit interconnection structure and green cleaning. |
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| Keywords: | electrical interconnection technology design for manufacture(DFM) package in package(PiP) virtual design interconnection structure green cleaning |
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