| ISD1700系列语音芯片原理与应用设计 |
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| 引用本文： | 曾婷,万星宇.ISD1700系列语音芯片原理与应用设计[J].价值工程,2011,30(23):144-145. |
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| 作者姓名： | 曾婷 万星宇 |
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| 作者单位： | 四川大学制造科学与工程学院,成都,610065 |
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| 摘 要： | 结合实际项目的开发经验,介绍了华邦电子的ISD1700系列语音芯片,给出了其管脚各功能、内部存储器结构、采样频率和工作方式模式,最后介绍了该系列语音芯片实际应用设计的两个典型实例,并得出相关结论。
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| 关 键 词： | ISD1700 语音芯片 工作模式 SPI 典型实例 |
Principles of ISD1700 Series Voice IC and Application Design |
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| Zeng Ting,Wan Xingyu.Principles of ISD1700 Series Voice IC and Application Design[J].Value Engineering,2011,30(23):144-145. |
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| Authors: | Zeng Ting Wan Xingyu |
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| Institution: | Zeng Ting;Wan Xingyu(Sichuan University College of Manufacturing Science and Engineering,Chengdu 610065,China) |
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| Abstract: | Combined with the actual project, the paper introduces the ISD1700 series of pronunciation chip of Winbond electronic company, gives the function of each tube feet, internal storage structure, sampling frequency and working mode, and finally introduces two typical example of this series of pronunciation chip ,then draw a conclusion. |
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| Keywords: | ISD1700 pronunciation chip work mode SPI typical examples |
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