多层微波集成电路中微带线层间互连仿真

针对多层微波集成电路设计的微带线层间互连问题，介绍了垂直通孔互连、垂直带条互连和层耦合过渡互连三种高性能的互连方法，并且采用三维电磁仿真软件HFSS对这三种互连结构进行了建模和仿真。仿真结果表明，垂直通孔互连和垂直带条互连在0.1～25 GHz的频宽范围内，回波损耗S11<-20 dB，插入损耗S21>-1 dB，互连性能优良，而层耦合过渡互连在20～68 GHz内回波损耗S11 <-20 dB，插入损耗S21>-1 dB，具有在毫米波频段实现互连的潜力。

Simulation of interconnection between microstrip lines in multilayer microwave integrated circuit

Three microstrip interconnection circuit structures of vertical via interconnection,vertical strip interconnection, and coupling transition between the layers are introduced and simulated for solving the problem of interconnection between microstrip lines in multilayer microwave intergration circuits(MuMICs). The simulation is done by using the 3D electromagnetic simulation software HFSS. The simulated result shows that the return loss (S11) and insertion loss (S21) of the vertical via interconnection and the vertical strip interconnection are <-20 dB and >-1 dB in 0.1~25 GHz,repectively, showing good connection performance. At the same time, the return loss (S11) and insertion loss (S21) of the coupling transition between the layers are <-20 dB and >-1 dB in 20~68 GHz,respectively,which shows this method has the potential to be used in millimeter wave bands.