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基于系统结构再造的芯片制造技术集成创新机理研究
引用本文:张贝贝,李娜,李存金.基于系统结构再造的芯片制造技术集成创新机理研究[J].科技进步与对策,2022,39(5):11-21.
作者姓名:张贝贝  李娜  李存金
作者单位:(北京理工大学 管理与经济学院,北京 100081)
基金项目:国家自然科学基金青年项目(72104027)
摘    要:芯片制造技术攻关是国家发展战略的迫切需求,提升该类技术自主创新水平是扭转我国集成电路产业核心技术受制于人的关键。以技术系统结构变化为切入点,基于结构再造原理,构建芯片制造技术集成创新机理理论框架,并以芯片光刻工艺专利数据为例进行实证研究。结果发现:①系统结构再造是实现技术集成创新的一种有效途径,在技术市场需求引导下,调整或重构芯片制造技术系统中技术元素之间的线性或非线性集成规则,使系统各部分间的关系更加协调、相互配合更加高效,从而推动原技术系统向高良品率、高集成度和低能耗芯片制造新技术系统转变;②芯片制造技术系统结构变化包括技术元素种类变化、元素间关联关系变化和元素比重变化3种原因;③根据系统结构变化程度,将结构再造分成结构调整和结构重组两类。该结论有助于加深相关企业和技术人员对芯片制造技术创新原理的理解,同时对复杂技术系统创新实践具有重要借鉴意义。

关 键 词:系统结构再造  芯片制造技术  集成创新  
收稿时间:2021-01-12

Research on the Integrated Innovation Mechanism of Chip Manufacturing Technology Based on System Structure Reengineering
Zhang Beibei,Li Na,Li Cunjin.Research on the Integrated Innovation Mechanism of Chip Manufacturing Technology Based on System Structure Reengineering[J].Science & Technology Progress and Policy,2022,39(5):11-21.
Authors:Zhang Beibei  Li Na  Li Cunjin
Institution:(School of Management and Economics, Beijing Institute of Technology, Beijing 100081, China)
Abstract:China's chip manufacturing technology started late and has developed rapidly with the strong support of national policies in recent years, but it is still at the low end of the global chip industry chain. There is still a large gap in the core technology of high-end products compared with developed countries, such as PC, server chip and lithography technology. In addition, with the rapid rise of China's economy, the United States has listed China as the primary containment object, and the trade friction between China and the United States continues to escalate, making chip manufacturing technology a bottleneck of the development of China's semiconductor industry.Under the influence of strengthened external restrictions, mastering the core chip manufacturing capability is the key for China to occupy the commanding height of core technology and build an independent chip manufacturing industrialization capability. There are many factors affecting chip core manufacturing capability. Only by mastering the basic innovation principles and methods of chip manufacturing core technology can we explore a unique path of innovative development in line with China's national conditions.#br#At present, the research on chip manufacturing technology and complex technology innovation mainly focuses on industrial development efficiency optimization, enterprise innovation strategy formulation, innovation performance evaluation and innovation network analysis. The research on innovation mechanism is limited, and the analysis of micro mechanism is relatively scarce. In order to realize the breakthrough of chip manufacturing technology innovation, we need to pay attention to government policies, organizational strategies and other factors from the macro level, as well as clarify the internal law of technology development from the micro level.#br#From the perspective of structural change of technology system, this paper constructs a theoretical interpretative framework of integrated innovation mechanism of chip manufacturing technology based on the principle of structural reengineering, and empirically analyzes the theoretical framework by taking the patent data of chip lithography process as an example. The results are as follows. (1) system structure reengineering is an effective way to realize technology integration innovation. Under the guidance of technology market demand, we should adjust or reconstruct the linear or nonlinear integration rules between technical elements in the chip manufacturing technology system, make the relationship between various parts of the system more coordinated and effectively promote the innovation of the original technology system, and form a new chip manufacturing technology system with high yield, high integration and low energy consumption. (2) The reasons for the structural changes of chip manufacturing technology system can be summarized as the variety, the relationship and the proportion changes of technology elements. (3) According to the change degree of system structure, structural reengineering can be divided into two types: structural adjustment and structural reorganization. #br#The research conclusions are conducive to deepening the understanding of chip manufacturing technology innovation principles for the relevant enterprises and technical personnel, and of reference significance for the innovation practice of complex technology system. The corresponding innovation management suggestions to the government, enterprises and technicians are listed below.#br#The government should formulate corresponding incentive policies to encourage the research on basic innovation principles in major and complex technology fields of chip manufacturing, build corresponding national innovation platforms, focus on the research on basic principles of core technology, and integrate resources in different social fields.#br#Enterprises should formulate reasonable talent introduction policies, actively build a technology innovation team integrating talents from multiple fields, create an open and cooperative corporate culture, actively establish connections with the outside world, establish an effective communication mechanism, improve the communication efficiency of internal and external personnel across organizations, teams and projects, maximize the integration of internal and external explicit knowledge and tacit knowledge to gear up for enterprises' resource integration ability.#br#Technicians should cultivate their own integrated innovation thinking on the basis of in-depth understanding of the complex technological innovation principles of chip manufacturing, and update the technical constituent elements from the perspective of system structure reengineering, improve the correlation between technical elements or change the proportion of technical constituent elements in the practice of technological innovation, adjust or restructure the original technical system structure, so as to provide more possibilities for core technology breakthroughs.#br#
Keywords:System Structure Reengineering  Chip Manufacturing Technology  Integrated Innovation  
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