| 国外电装印制板标准跟踪研究 |
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| 引用本文： | 张伟.国外电装印制板标准跟踪研究[J].世界标准化与质量管理,2009(9):89-96. |
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| 作者姓名： | 张伟 |
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| 作者单位： | 中国航天标准化研究所,北京,100071 |
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| 摘 要： | 文章分析了电子装联技术和印制板在航天电子电气产品中的重要性和当今电子技术的新发展，提出了标准研究的意义，介绍了国外电装印制板标准，提出了我国航大电装印制板标准的发展方向。
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| 关 键 词： | 表面帖装技术 无铅焊接 IEC标准 IPC标准 NASA标准 ECSS标准 MIL标准 |
Trace and Research on the Foreign Standards of Electronic Assembly and Printed Circuit Board |
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| ZHANG Wei.Trace and Research on the Foreign Standards of Electronic Assembly and Printed Circuit Board[J].World Standardization & Quality Management,2009(9):89-96. |
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| Authors: | ZHANG Wei |
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| Institution: | ZHANG Wei (China Astronautics Standards Institute, Beijing 100071, China ) |
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| Abstract: | This paper analyzes the importance of electronic assembly technology and printed circuit board in the aerospace electronic products and the latest developments of the electronic technology. It points out the significance of standards and introduces the foreign standards of the electronic assembly and printed circuit board. And it proposes the direction of standards development in the electronic assembly and printed circuit board in China aerospace. |
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| Keywords: | surface mount technology lead-free soldering IEC standards IPC standards NASA standards ECSS standards MIL standards |
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