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高阻隔陶瓷薄膜包装材料的研究进展及关键技术
引用本文:孙智慧,刘壮,智慧,林晶.高阻隔陶瓷薄膜包装材料的研究进展及关键技术[J].中国印刷物资商情,2010(1):1-8.
作者姓名:孙智慧  刘壮  智慧  林晶
作者单位:[1]哈尔滨商业大学轻工学院,哈尔滨150028 [2]黑龙江省生物产业软包装材料工程技术研究中心,哈尔滨150028
基金项目:国家“十一五”科技支撑计划资助项目(No.2006BAD05A05)
摘    要:本文总结了高阻隔陶瓷薄膜包装材料制造技术的发展进程,介绍了各种镀膜方法及特点;系统综述了国内外AlOx、SiOx薄膜的研究进展与应用现状,分析了陶瓷薄膜包装材料制造过程中影响阻隔性能的主要因素,研究了提高薄膜阻隔性的基本措施,由此展望了高阻隔陶瓷薄膜包装材料发展及应用前景。

关 键 词:高阻隔  陶瓷薄膜  磁控溅射

Research of High-Barrier Ceramic Film Packaging Materials and Key Technologies
SUN Zhihui,LIU Zhuang,ZHI Hui,LIN Jing.Research of High-Barrier Ceramic Film Packaging Materials and Key Technologies[J].China Printing Materials Market,2010(1):1-8.
Authors:SUN Zhihui  LIU Zhuang  ZHI Hui  LIN Jing
Institution:1.Light Industry College,Harbin University of Commerce,Harbin 150028,China;2.Heilongjiang Province Biology Industry Soft Packaging Material Engineering Technology Research Center,Harbin 150028,China)
Abstract:In this paper,the high-barrier ceramic film packaging materials manufacturing technology development process was summarized.A variety of coating methods and characteristics were introduced.Research progress and application status of AlOx and SiOx film at home and abroad were overviewed.By analysing the main factors affecting the barrier properties during ceramic film packaging material manufacturing processes,the basic measures which can improve barrier properties were studied.Lastly,the development and application prospects of the high-barrier ceramic film packaging materials are made.
Keywords:High-barrier Ceramic film Magnetron Sputtering
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