采用铜导电油墨在改性柔性基材上实现喷墨印刷

本文采用铜导电油墨在聚酰亚胺（PI）薄膜上进行喷墨印刷形成铜导电层,并研究基于铜络合物的铜导电油墨与柔性基材的相关性。本研究首先采用氧等离子体对PI薄膜表面进行改性,以测试接触角来表征改性前后薄膜表面性能的变化。通过优化等离子体反应参数使接触角降低。再利用喷墨印刷在改性前后PI薄膜上沉积铜导线,在200℃氢气环境下进行热处理,印制铜线发生烧结而收缩。采用光学显微镜（OM）、场发射扫描电子显微镜（FESEM）、X射线衍射（XRD）、非接触式三维轮廓仪和四点探针分析铜导线形状、微观结构、晶体结构及电导率。结果表明,经氧等离子体改性的PI基材上可成功沉积具有纯铜相的连续铜导线且具有良好的烧结微观结构,同时确定了铜导电油墨与基材表面性能的相关性。

Ink-Jet Printing of Cu Conductive Ink on Flexible Substrate Modified by Oxygen Plasma Treatment

We conducted ink-jet printing of copper（Cu）conductive ink on polyimide（PI）film to form Cu conductive patterns and determine the correlation between Cu ink based on Cu complex and flexible substrate.First,the oxygen plasma treatment was performed to modify the surface property of the PI film,and contact angles were measured to confirm the change of its surface property.Thus,we confirmed the decrease of contact angles and optimized plasma treatment parameters. Then Cu conductive lines were formed on unmodified and modified PI film using ink-jet printing,and the printed lines were reduced and sintered by thermal treatment in hydrogen（H_2）atmosphere at 200℃.The formed Cu conductive lines were analyzed by optical microscope（OM）,field emission scanning electron microscope（FE-SEM）,x-ray diffractometry （XRD）,non-contact 3D profiler,and four-point probe to confirm the shape,microstructure,crystal structure of conductive lines,and electrical conductivity.The continuous lines having pure Cu phase and well-sintered microstructure were successfully formed on PI substrate modified by oxygen plasma treatment and the correlation between Cu ink and substrate surface property was determined.