| 快速高密度互连印制板加工工艺 |
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| 引用本文： | 詹为宇.快速高密度互连印制板加工工艺[J].国际商务研究,2004,44(2):179-181. |
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| 作者姓名： | 詹为宇 |
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| 作者单位： | 中国西南电子技术研究所 四川成都610036 |
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| 摘 要： | 先进加工设备进入印制板加工行业,促进了工艺变革。一台UV激光多功能微线钻的快速加工能力已与中小规模印制板厂能力相仿。应用新的工艺设备,可大大简化工艺流程,实现HDI(高密度互连印制板)加工向高精度、快速化发展。
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| 关 键 词： | UV激光微线钻 HDI 高密度互连印制板 工艺流程 电镀 金属化 |
Fast HDI Processing Technology |
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| ZHAN Wei-yu.Fast HDI Processing Technology[J].International Business Research,2004,44(2):179-181. |
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| Authors: | ZHAN Wei-yu |
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| Abstract: | The advanced manufacturing equipment''s entering into the manufacturing industry of printed circuit board has accelerated the change of process. Now a multi-purpose laser "microline drill" equipment with finish machining ability is similar to a factory with medium machining ability. Since new technology equipment is applied to produce HDI, the technologic flow has been simplified. The high density interlinked printed circuit board process with high accurate and celerity had been realized. |
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| Keywords: | PCB Fast HDI technology UV Laser "microline drill |
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