| 板级立体组装侧向互联技术 |
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| 引用本文： | 郑大安,郑国洪,周宇戈. 板级立体组装侧向互联技术[J]. 国际商务研究, 2007, 47(3): 185-188 |
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| 作者姓名： | 郑大安 郑国洪 周宇戈 |
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| 作者单位： | 中国西南电子技术研究所,成都610036 |
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| 摘 要： | 通过对板级立体组装侧向互联可制造性设计技术、组装工艺技术等进行研究,确定了板级立体组装侧向互联形式及连接件的设计、排布和数量,实现了板级立体组装侧向互联技术.
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| 关 键 词： | 立体组装 侧向互联 谐响应分析 有限元分析 结构动力学分析 |
| 收稿时间： | 2006-08-10 |
| 修稿时间： | 2007-03-14 |
PCB-based 3D Assembly Side-face Inter-connected Technology |
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| ZHENG Da-an,ZHENG Guo-hong,ZHOU Yu-ge. PCB-based 3D Assembly Side-face Inter-connected Technology[J]. International Business Research, 2007, 47(3): 185-188 |
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| Authors: | ZHENG Da-an ZHENG Guo-hong ZHOU Yu-ge |
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| Affiliation: | Southwest China Institute of Electronic Technology, Chengdu 610036 ,China |
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| Abstract: | By the study of 3D assembly based on PCB side- face inter- connected producible design and assembly technology, the PCB side -face inter -connected form and the design, array, and number of its linker are determined, thus realizing the technology. |
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| Keywords: | 3D assembly side- face inter- connected harmonic response analysis finite element analysis configuration dynamic analysis |
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