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封套的光热环境与表面热流影响因素分析
引用本文:易建政,梁 波.封套的光热环境与表面热流影响因素分析[J].河北工业科技,2008,25(6):346-348,351.
作者姓名:易建政  梁 波
作者单位:1. 军械工程学院静电与电磁防护技术研究所,河北石家庄,050003
2. 军械工程学院静电与电磁防护技术研究所,河北石家庄,050003;中国人民解放军第72478部队,山东济南,250310
摘    要:从封套所处的光热环境出发,介绍了封套与环境之间几种典型的热量交换形式,包括:太阳辐射、大气逆辐射、地面的热反射与热辐射,以及封套表面的对流换热等。在合理假设的基础上,构建了封套传热的数学模型,分析了几种主要因素对封套表面热流密度的影响。研究结果对弹药等的野外储存具有一定的指导意义。

关 键 词:封套  光热环境  热流密度  数学模型
收稿时间:2008/6/25 0:00:00
修稿时间:2008/7/10 0:00:00

Light thermal environment and surface heat current analysis of envelope
YI Jian-zheng and LIANG Bo.Light thermal environment and surface heat current analysis of envelope[J].Hebei Journal of Industrial Science & Technology,2008,25(6):346-348,351.
Authors:YI Jian-zheng and LIANG Bo
Institution:YI Jian-zheng1,LIANG Bo1,2(1.Electrostatic , Electromagnetic Protection Research Institute,Ordnance Engineering College,Shijiazhuang Hebei 050003,China,2.No.72478 Unit of PLA,Jinan Sh,ong 250310,China)
Abstract:Several kinds of heat exchange between envelope and environment were introduced,such as sun radiation,air athwart radiation,heat echo and radiation of ground and heat convection on envelope surface.Based on some proper assumptions,the mathematic model of heat-transmit was constructed,and the equations of heat current density on envelope surface were established.The effect of several kinds of factors on heat current was analysed.The result had some instructional meaning to the field storage of ammunition.
Keywords:envelope  light thermal environment  heat current density  mathematic model  
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