| 金丝球焊质量控制的探讨 |
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| 引用本文： | 李永常. 金丝球焊质量控制的探讨[J]. 国际商务研究, 1988, 0(2) |
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| 作者姓名： | 李永常 |
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| 作者单位： | 电子部第十研究所 高级工程师 |
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| 摘 要： | 本文论述了金丝超声热压球焊在混合集成电路焊接中取得成功必须注意:对焊机功能的正确调整,选取合适的焊接工具和材料.在实践中规范焊接参数,并给出了焊接中各种现象的分析.这些工作的开展有利于提高金丝球焊的焊接质量.
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| 关 键 词： | 微电子技术 焊接工艺 超声热压球焊 |
Discussion of quality control of gold wire ball bonding |
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| Li Yong Chang,The Tenth Research Institute of the Ministry of Electronics Industry. Discussion of quality control of gold wire ball bonding[J]. International Business Research, 1988, 0(2) |
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| Authors: | Li Yong Chang The Tenth Research Institute of the Ministry of Electronics Industry |
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| Abstract: | Making a sucess of gold wire thermosonic ball bonding in hybrid integrated circuit must be:correct function adjustment of bonding machine,selecting suitable bonding tools and material.The parameters of bonding are normalized in practice,and the analysis of various phenomena in the bonding process is given.Development of these work is of benefit to raising quality of gold wire ball bonding. |
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| Keywords: | Microelectronics Bonding Technology Thermosonic Ball Bonding |
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