| 裸芯片组装微电路失效机理的研究 |
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| 引用本文： | 李永常. 裸芯片组装微电路失效机理的研究[J]. 国际商务研究, 1990, 0(4): 17-21 |
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| 作者姓名： | 李永常 |
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| 作者单位： | 机电部第十研究所 高级工程师. |
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| 摘 要： | 本文总结了几年来我们制作的微电路发生失效的情况,对失效的机理进行了分析并研究相应的可靠性保障技术,逐步形成二次集成微电路小批量投产的质量控制体系,从而使产品的成品率与可靠性有了明显的长足进步.提供的产品满足了整机的技术要求促进整机在小型化和高可靠性方面上一级新台阶.
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| 关 键 词： | 裸芯片 集成电路 组装 失效 芯片 |
Research on failure mechanism of assembly microcircuit with bare chips |
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| Senior Engineer Li Yongchang. Research on failure mechanism of assembly microcircuit with bare chips[J]. International Business Research, 1990, 0(4): 17-21 |
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| Authors: | Senior Engineer Li Yongchang |
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| Affiliation: | The Tenth Research Institute of Ministry of the Machine-Building and Elcctronics Industry |
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| Abstract: | In the paper we summed situation of failure in making microcircuit over the years and analyzed mechanism of failure. For this reason we have researched corresponding technology of reliability guarantee and formed quality control system of smallmass production of sencond integrated microcircuit step bystep.Thus, yield of products and reliability have increased obviously.Products can satisfy requirements of system engineering and promote it to rise a new step as respects of miniaturization and reliability. |
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| Keywords: | Microelectronics Reliability Failure Mechanism |
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