| 铜厚膜环行器的研制 |
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| 引用本文： | 戴宴平,侯国栋.铜厚膜环行器的研制[J].国际商务研究,1990(6). |
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| 作者姓名： | 戴宴平 侯国栋 |
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| 作者单位： | 机电部第十研究所，机电部第十研究所 研究生，指导老师，研究员 |
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| 摘 要： | 采用新型的在大气气氛中烧结的铜厚膜多层导电浆料,应用厚膜混合技术制作了2。2GHz和2.8GHz的环行器。其性能指标可与同类型采用薄膜贵金属制作的环行器相媲美,且工艺简单,成本低及生产周期短。
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| 关 键 词： | 微波集成电路 铜厚膜电路 环行器 |
Development of copper thick film circulators |
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| Graduat Student Dai Yanping Research Fellow Hou Guodong.Development of copper thick film circulators[J].International Business Research,1990(6). |
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| Authors: | Graduat Student Dai Yanping Research Fellow Hou Guodong |
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| Institution: | The Tenth Institute of Ministry of Machine-Building and Electronics Industry |
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| Abstract: | using a new copper thick film pastc firing in the air, we made 2.2 GHz and 2.8GHz circulators by use of thick film hybrid technology. Their Performance targets may compare with those of similar circulators which are made from thin film noble metal. In doing so, technology is simple, the cost is low and producting time is short. |
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| Keywords: | MIC Copper Thick Film Circuit CirCulators |
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