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单体对UV固化体系流变行为的影响
引用本文:罗开元,魏先福,黄蓓青,余木群,顾灵雅. 单体对UV固化体系流变行为的影响[J]. 中国印刷物资商情, 2012, 0(6): 38-42
作者姓名:罗开元  魏先福  黄蓓青  余木群  顾灵雅
作者单位:北京印刷学院印刷与包装工程学院,北京102600
基金项目:北京市教委创新人才项目--油墨分散性及UV系列油墨产业化技术研究(No.PHR201006126);北京市科技计划重大项目--喷墨数字印刷机系列环保墨水研究(No.D111100001811001)
摘    要:本研究采用流变动力学来表征UV固化体系的固化性能,使用装有UV固化配件的流变仪,实时监测光固化过程中UV固化体系动态弹性模量G'的变化,考察了单体的种类、含量对固化体系性能的影响。并将流变转化率β与体系动态弹性模量G'关联起来,进一步推导出可以描述固化反应的非线性动力学方程。结果表明:UV体系固化过程中,单体官能度越大,样品G'值越快达到平衡,固化速率越快;单体含量越高,G'达到平衡状态所需时间越长;实验推导出的非线性动力学方程使用流变转化率β表征UV固化体系固化反应进行的程度,使用dβ/dt表征UV固化体系的固化速率,通过实时红外测试验证了该方程的可行性。

关 键 词:单体  UV固化体系  流变动力学  固化速率

Effect of Monomers on Rheological Behavior of UV Curing System
LUO Kai-yuan,WEI Xian-fu,HUANG Bei-qing,YU Mu-qun,GU Ling-ya. Effect of Monomers on Rheological Behavior of UV Curing System[J]. China Printing Materials Market, 2012, 0(6): 38-42
Authors:LUO Kai-yuan  WEI Xian-fu  HUANG Bei-qing  YU Mu-qun  GU Ling-ya
Affiliation:(School of Printing and Packaging Engineering, Beijing Institute of Graphic Communication, Beijing 102600, China)
Abstract:In this study, rheological dynamics was used to characterize curing property of radical polymerization reaction which initiated by UV light. Changes of dynamic modulus G' in every stage of curing process were real - time monitored u- sing a rheometer equipped with UV curing accessory. The influence of varieties and contents of monomers on curing property was studied. Associating rheology conversion rate β with G' , a nonlinear kinetic equation was set up to describe the cure reaction. The results showed that the quantity of functionality is higher, the balance of sample' s G' value is easier to reach, the curing rate is faster during the curing process. The content of monomer is higher, the time of G' value reaching to bal- ance is longer. The curing reaction degree of UV curing system could be characterized by r, and the curing rates could be characterized by d β/dt in nonlinear kinetic equation. This method was proved feasible by infrared spectroscopy.
Keywords:Monomer  UV curing system  Rheological dynamics  Curing rate
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